As a leading manufacturer of non-standard testing equipment, Ziwei Testing offers a wide range of solutions for automotive and industrial applications. Today, we are pleased to introduce our: Thermal Interface Material Thermal Conductivity Tester (Heat Flow Method).
Thermal Interface Material Thermal Conductivity Tester (Heat Flow Method) is a high-precision and highly versatile thermal performance testing instrument. It is primarily designed to test the thermal resistance, thermal contact resistance at solid interfaces, and thermal conductivity of various fine solid materials, such as thin thermal conductors, thermal conductive silicone pads, thermal conductive resins, and alumina ceramics.
The equipment is suitable for standard solid sheet specimens. When equipped with specialized containment frame accessories, it can also perform thermal performance testing on powder and paste materials. It is widely applied in quality inspection and scientific research across fields such as electronic thermal management materials, new ceramic materials, and insulating materials.
Testing Items: Thermal Contact Resistance, Thermal Conductivity.
Applicable Standards:
ASTM-D5470-17 "Standard Test Method for Thermal Transmission Properties of Thermally Conductive Electrical Insulation Materials"
GB/T 29313-2012 "Test methods for thermal transmission properties of electrical insulating materials"
GB 5598-85 "Method for determination of thermal conductivity of beryllium oxide ceramics"
Technical Parameters:
| Parameter | Specification |
| Temperature Range |
20-140°C Hot plate: Room temperature ~ 150.00°C |
| Thermal Conductivity | Measurement range: 0.1–50 W/(m·K) Accuracy: 0.1–5 W/(m·K), error ≤ 3%; 5–50 W/(m·K), error ≤ 5% |
| Thermal Resistance Range | Test range: 0.05–500 cm²·K/W Accuracy: 10–500 cm²·K/W, error ≤ 3%; 0.05–10 cm²·K/W, error ≤ 5% |
| Thermal Contact Resistance Test | Error ≤ 5% |
| Test Head Size | Φ25.4 mm |
| Specimen Size | Φ25.4 mm; Thickness: 0.2–20 mm |
| Pressure Measurement | Range: 0–2000 N; Control mode: Motorized (Electric) |
| Specimen Thickness Measurement Range | 0–30 mm |
| Power Supply | 220V 50Hz |
| Operating Environment | Constant temperature and humidity; Laboratory temperature ±5°C |
The equipment adopts heat flow testing technology, integrating automated control and high-precision sensing technology. It features core advantages such as convenient operation, high testing efficiency, accurate data, and wide adaptability. The specific features are as follows:
- Excellent Testing Performance
Based on the core heat flow technology, it can quickly and accurately complete the testing of thermal conductivity and thermal contact resistance for various materials, with strong testing stability and excellent repeatability.
- Wide Range of Specimen Adaptability
It can accommodate test specimens in various forms, including solids, powders, coatings, films, and liquids, covering the testing requirements for the vast majority of new thermal conductive and insulating materials.
- High Degree of Automation
It supports fully automatic pressurization within the 0–2000 N range and can automatically measure the specimen thickness without manual intervention, significantly reducing human operational errors.
- Intelligent and Visualized Operation
Equipped with interactive graphical software, it allows full-process control of core parameters such as testing pressure, specimen temperature, and thickness. It displays test data in real time and supports the automatic generation of thermal parameter vs. thickness curves, making the data intuitive and traceable.
- Stable Temperature Control System
Equipped with a dedicated circulating cooling water bath system, it precisely regulates the temperature of the cooling unit to ensure a constant temperature throughout the testing process, providing a fundamental guarantee for high-precision testing.
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Founded in Shenyang, we have grown into a leading National High-Tech Enterprise. Through continuous innovation and precision engineering, we provide advanced testing solutions for automotive, aerospace, and research institutions worldwide.