【Test items】
Lock the liquid cooling plate onto the tested chip, connect the liquid inlet and outlet of the liquid cooling plate to the thermal performance test system, ensure that non condensable gases in the testing loop are exhausted, and adjust the liquid flow rate through the liquid cooling plate to the desired value, applying the desired power consumption to the tested chip; After the test results are stable, record the pressure values P1 and P2 at the inlet and outlet of the liquid cooling plate, the shell temperature Tc of the tested chip, the liquid temperature TL at the inlet of the liquid cooling plate, the power consumption value Q applied to the tested chip, and the liquid flow rate through the liquid cooling plate.
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